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Modeling And Design Of Electromagnetic Compatib...



Feko has been a leader in high-frequency electromagnetic simulation for over 20 years. Building on this strong legacy it now delivers a cost-effective package of parallelized solvers to design products for an increasing connected world.




Modeling and Design of Electromagnetic Compatib...


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Feko addresses the broadest set of high-frequency electromagnetics applications allowing teams to optimize wireless connectivity, including 5G, ensure electromagnetic compatibility (EMC), and perform radar cross section (RCS) and scattering analysis. From antenna simulation and placement, radio coverage, network planning, and spectrum management, to electromagnetic compatibility (EMC/EMI), radome modeling, bio-electromagnetics and RF devices, Feko combines with other Altair tools to optimize system performance through machine learning and reduce modeling time for complex systems.


Electric machine design is increasingly important for both performance and sustainability. Simcenter provides multi-disciplinary solutions for validating e-machine designs from early concept through systems integration, as well as detailed performance engineering, including models for validation of control strategies. Both electromagnetic and thermal aspects of electric motors can be simulated.


Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.


His main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.


Multipurpose, full wave 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, components, interconnects, connectors, ICs and PCBs.


Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters, connectors, IC packages and printed circuit boards. Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and internet-of-things (IoT) products.


Ansys HFSS is a 3D electromagnetic simulation software solution for designing and simulating high-frequency electronic products such as antennas, RF and microwave components, high-speed interconnects, filters, connectors, IC components and packages and printed circuit boards.


The Ansys HFSS simulation suite consists of a comprehensive set of solvers to address diverse electromagnetic problems ranging in detail and scale from passive IC components to extremely large-scale EM analyses such as automotive radar scenes for ADAS systems. Its reliable automatic adaptive mesh refinement lets you focus on the design instead of spending time determining and creating the best mesh.


Ansys Electronics Desktop enables engineers to easily combine the unmatched accuracy of Ansys electromagnetic 3D and 2.5D field solvers and the powerful circuit- and system-level solutions in Ansys RF Option to diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.


Users can take advantage of the seamless workflow in Electronics Desktop, which includes advanced electromagnetic field solvers, and dynamically link them to power circuit simulators to predict EMI/EMC performance of electrical devices. These integrated workflows avoid repetitive design iterations and costly recurrent EMC certification tests. Multiple EM solvers intended to address diverse electromagnetic problems, as well as the circuit simulators in Electronics Desktop, help engineers assess the overall performance of their electrical devices and create interference-free designs. These diverse problems range from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications.


EMIT works hand-in-hand with Ansys HFSS to combine RF system interference analysis with best-in-class electromagnetic simulation for modeling installed antenna-to-antenna coupling. The result is a complete solution to reliably predict the effects of RFI in multi-antenna environments with multiple transmitters and receivers.


A candidate array design can examine input impedances of all elements under any beam scan condition. Phased array antennas can be optimized for performance at the element, subarray or complete array level based on element match (passive or driven) far-field and near-field pattern behavior over any scan condition of interest. Infinite array modeling involves one or more antenna elements placed within a unit cell. The cell contains periodic boundary conditions on the surrounding walls to mirror fields, creating an infinite number of elements. Element scan impedance and embedded element radiation patterns can be computed, including all mutual coupling effects. The method is especially useful for predicting array-blind scan angles that can occur under certain array beam steering conditions. Finite array simulation technology leverages domain decomposition with the unit cell to obtain a fast solution for large finite-sized arrays. This technology makes it possible to perform complete array analysis to predict all mutual coupling, scan impedance, element patterns, array patterns and array edge effects.


HFSS with SI Circuits can handle the complexity of modern interconnect design from die-to-die across ICs, packages, connectors and PCBs. By leveraging the HFSS advanced electromagnetic field simulation capability dynamically linked to powerful circuit and system simulation, engineers can understand the performance of high-speed electronic products long before building a prototype in hardware.


Learn about new features & capabilities, including flex PCB modeling and simulation support, IC design flows with encrypted IP, and further reductions in simulation turnaround time without accuracy loss.


In the current context of aircraft electrification, the aerospace industry needs to address increased design complexity and higher levels of integration, which can easily impact program cost and product time-to-market. System electrification, including electrified propulsion, being one of the major trends in the industry, comes with challenges related to electromagnetic compatibility (EMC). This article discusses EMC engineering challenges and solutions for an electrified unmanned aerial vehicle (UAV).


Aircraft regulatory standards and compliance The aircraft design must meet specific Federal Aviation Association (FAA) regulations and guidelines related to EMC to achieve safety compliance (Fig.1). High-intensity Radiated Field (HIRF) testing ensures all aspects of electrical wiring, installations, and aircraft-level systems are safe for operation so the aircraft can still fly. For example, at an airport with a large radar that sends a signal to the planes, the aircraft will still function properly even with an external field that could cause electromagnetic interference (EMI).


Engineers can use CST EMC STUDIO to analyze designs for electromagnetic compatibility and electromagnetic interference in such applications as aerospace, printed electronics and telecommunications. Image courtesy of Computer Simulation Technology AG.


The conceptual design is a crucial phase for the System Architects to evaluate 3D architecture concepts of mechatronic systems mainly with regard to the ElectroMagnetic Compatibility (EMC). Our research work deals with the combination of electromagnetic modeling and a topological approach to support the qualitative and quantitative ElectroMagnetic Interferences (EMI) evaluation process within the MBSE SAMOS approach as of the conceptual design. For a given interference, the analysis of topological models allows the qualitative identification of the existence of victims with their associated potential aggressors, based on the electrical schema of interacting components. Then, once the potential EMIs have been qualitatively identified, a quantitative evaluation can be performed based on the predefined electromagnetic and geometrical requirements, and on the analysis of the identified physical coupling law. Finally, this approach has been applied to the alien crosstalk occurring in an electrical vehicle powertrain, with a quantitative evaluation based on the two following methods: an analytical approach and Kron's approach. 041b061a72


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